非晶态和纳米合金的化学镀 制备原理、微观结构和理论PDF|Epub|txt|kindle电子书版本网盘下载

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Part Ⅰ History of Electroless Plating4

1．History-From the Discovery of Electroless Plating to the Present4

1.1 Discovery of Electroless Plating4

1.1.1 EarlyWorks4

1.1.2 Brenner and Riddell's Work6

1.2 Early Stage of Development(1940s-1959)9

1.2.1 Research Works9

1.2.2 Patents Issued10

1.2.3 Preliminary Applications12

1.3 Slow Growth of Period(1960-1979)12

1.3.1 Improvement of the Plating Bath13

1.3.2 Various Electroless Plating Metals17

1.3.3 Electroless Plating Cu20

1.3.4 Deposition Substrate23

1.3.5 Application26

1.4 Rapid Development of Period(1980-1999)26

1.4.1 Studying the Nature of Electroless Plating26

1.4.2 Studying the Properties of Electroless Plating Deposits27

1.4.3 Large-Scale Application in Many Industries31

1.4.4 Investigation of Temary and Multicomponent Alloys and Composites33

1.4.5 Electroless Plating Began and Developed Rapidly in China34

1.4.6 Electroless Plating Fe-B Based Alloys Have Been Proposed and Developed35

1.5 In-Depth Development and Nanoelectroless Plating Stage(2000-Present)36

1.5.1 In-Depth Investigation of the Mechanism and Theory in Electroless Plating38

1.5.2 Rapid Development of Nanoelectroless Plating38

1.6 Summary and Prospect39

References40

Part Ⅱ Technology of Electroless Plating-Plating Bath,Critical Parameters, Deposition Rate,and Stability of Plating Bath51

2．Electroless Plating Baths of Metals,Binary Alloys,and Multicomponent Alloys51

2.1 General Consideration for Electroless Plating Bath Solution51

2.2 Plating Bath of Electroless Pure Nickel and Nickel-Based Binary Alloys53

2.2.1 Pure Ni and Co Metals53

2.2.2 Ni-P53

2.2.3 Ni-B53

2.3 Cobalt-Based Binary Alloys57

2.3.1 Co-P57

2.3.2 Co-B57

2.4 Cu and Copper-Based Binary Alloys58

2.5 Au58

2.6 Ag58

2.7 Pd and Palladium-Based Binary Alloys59

2.8 Pt and Platinum-Based Binary Alloys59

2.9 Ru,Rh,Os,and Cr-P Binary Alloys59

2.10 Group B Metals(Zn,Cd,In,Sn,Pb,As,Sb,and Bi)and a Few Binary Alloys of these Metals62

2.11 Electroless Plating of Ternary Alloys67

2.11.1 Ni-Me-P Alloy Plating Baths67

2.11.2 Co-Me-P Alloy Plating Baths74

2.11.3 Ni-Me-B Alloy Plating Baths74

2.11.4 Co-Me-B Alloy Plating Baths74

2.11.5 Other Ternary Alloy Plating Baths89

2.12 Electroless Plating of Quaternary Alloys90

2.12.1 Ni-Based Quaternary Alloy Plating Baths90

2.12.2 Co-Based Quaternary Alloy Plating Baths90

2.13 Electroless Plating Quinary and Multialloys90

2.14 Summary90

References100

3．Electroless Composite Plating108

3.1 General Considerations about ECP109

3.2 Bath Solutions of ECP110

3.2.1 Bath for Binary Alloy-Based ECP110

3.2.2 Bath for Ternary Alloy-Based ECP113

3.2.3 Bath for ECP With Two Kinds of Particles116

3.3 Summary116

References138

4．Nano Electroless Plating144

4.1 Bulk Nano EP Materials144

4.1.1 Nano ECP144

4.1.2 EP Three-Dimensional Nanostructured Materials(3D NSMs)163

4.2 2D Nano EP Materials172

4.2.1 EP 2D Nano Films173

4.2.2 EP 2D Nanoplates181

4.2.3 EP 2D Nanodisks182

4.2.4 EP 2D Nanoshells and Nanosheets183

4.2.5 EP 2D Nanowalls184

4.2.6 EP 2D Nano Ci rcles and Rings185

4.2.7 EP 2D Nanohoneycomb187

4.2.8 EP 2D Nanoline,Nanofin Pattern,and 2D Nano Grating188

4.3 Linear(1D)Nano EP Materials191

4.3.1 EP Nanotubes191

4.3.2 EP Nanowires214

4.3.3 EP Nanorods240

4.3.4 EP Nanobelts246

4.4 Zero-Dimensional Nano EP Materials250

4.4.1 EP Nanoparticles251

4.4.2 EP Nanoparticle Arrays262

4.4.3 EP Nanoparticles Other Than Spherical Shape264

4.4.4 EP Core-Shell Nanoparticles268

4.5 Summary278

References279

5. Electroless PlatingFe-Based Alloys291

5.1 Why Electroless Plating Fe-B Alloys?291

5.2 Discovery of EP Fe-B Alloys292

5.2.1 The Plating Bath and Affective Parameters294

5.2.2 Analysis of the Difficulty in Obtaining EP Fe-B Alloys295

5.2.3 Composition,Structure,and Properties of EP Fe-B Alloys296

5.2.4 Formation Mechanism of EP Fe-B Alloys303

5.2.5 Problems and Worthwhile Improvements for EP Fe-B Alloys304

5.3 EP Binary Fe-B Alloys305

5.4 EP Fe-B-Based Multicomponent Alloys307

5.4.1 EP Fe-W-B Alloy Deposits308

5.4.2 EP Fe-Mo-B Alloy Deposits310

5.4.3 EP Fe-Sn-B Alloy Deposits312

5.4.4 EP Fe-W-Mo-B Alloy Deposits313

5.4.5 EP Fe-Ni-B Alloy Deposits315

5.5 EP Fe-PAlloys315

5.6 EP Fe-P-Based Ternary-Component Alloys317

5.7 Summary319

References319

6．Impact Parameters and Deposition Rate324

6.1 Effects of Plating Bath Components on Deposition Rate324

6.1.1 Effect of Metal Salts324

6.1.2 Effect of Reducing Agent334

6.1.3 The Effect of Complexing Agent337

6.1.4 Effect of Stabilizer342

6.1.5 Effect of Accelerating Agent349

6.1.6 The Effect of Surfactants352

6.2 Effects of Operating Conditions357

6.2.1 Effect of pH Value357

6.2.2 Effect of Plating Temperature361

6.2.3 Effect of Plating Time362

6.3 Effects of other Technological Parameters364

6.3.1 Effect of Stirring364

6.3.2 Effect of Magnetic Field372

6.3.3 Effect of Bath Loading373

6.4 Summary376

References376

7．Green Electroless Plating383

7.1 What is Green Electroless Plating?383

7.2 Green Electroless Plating of EN384

7.3 Green Electroless Plating on Cu390

7.3.1 Hypophosphite390

7.3.2 Glyoxylic Acid393

7.3.3 DMAB395

7.3.4 Sodium Bisulfate397

7.3.5 Co2+ and Fe2+397

7.3.6 Saccharide400

7.3.7 Green Ligand for EP Cu400

7.4 Green Electroless Plating Ag401

7.5 Green Electroless Plating Au403

7.6 Summary406

References406

Part Ⅲ Composition,Microscopic Structure,and Surface Morphology of Electroless Deposits415

8．Composition and Microstructure415

8.1 Composition and Microstructures of EP Alloy Deposits415

8.1.1 Ni-P Alloy Deposits415

8.1.2 Other EP Binary Deposits440

8.1.3 Binary Alloy-Based ECP Deposits449

8.2 Composition and Microstructures of EP Ternary and Multicomponent Alloy Deposits451

8.2.1 Effects of Metal Salts on Composition and Structure in Ternary and Quaternary Alloy Coatings452

8.2.2 Effects of Reductant on Composition and Structure in Ternary and Quaternary Alloy Coatings455

8.2.3 Effects of Complexing Agents on Composition and Structure in Ternary and Quaternary Alloy Coatings458

8.2.4 Effects of pH Value on Composition and Structure in Ternary and Quaternary Alloy Coatings459

8.2.5 Effects of Temperature on Composition and Structure in Ternary and Quaternary Alloy Coatings462

8.2.6 Influence of Ultrasound on Composition and Structure of EN Deposits464

8.3 Crystallization of EP Amorphous Alloys467

8.3.1 Crystallization Process and Products of EP Alloys Deposits468

8.3.2 Crystallization Temperature and Activation Energy of EP Alloy Deposits482

8.3.3 Crystallization Transformation Kinetics of EP Alloy Deposits495

8.4 Summary498

References498

9．Surface Morphologies505

9.1 Skeleton Understanding of Surface Morphologies of the EP Alloy Coatings505

9.1.1 What Magnification Can See the Morphology Clearly?505

9.1.2 What Are the Morphological Features for Ni-P Based Alloy Deposits?508

9.1.3 What is the Influence of Alloying Elements on the Surface Morphology of Ni-P Based Alloy Deposits?509

9.1.4 Is there a Quantitative RelationshiP Between the Particle Size and Alloy Composition?510

9.1.5 Should the Surface Morphology of Electroless Amorphous Coatings Be a Distinctive Pattern or Featureless?512

9.2 The Effect of Alloying Elements on SEM514

9.2.1 The Surface Morphology of EP Pure Metals514

9.2.2 The Surface Morphology of EP Binary Alloy Films517

9.2.3 The Surface Morphology of EP Multicomponent Alloy Films520

9.3 Surface Morphology of ECP Alloy Deposits531

9.4 Effects of Various Parameters on SEM536

9.4.1 Effects of the Concentration of Metal Salts on SEM536

9.4.2 Effects of Reductant on SEM540

9.4.3 Effects of Complexing Agents on SEM542

9.4.4 Effects of Stabilizers on SEM544

9.4.5 Effects of Surfactants on SEM549

9.4.6 Effects of pH Values on SEM555

9.4.7 Effects of Plating Temperature on SEM559

9.4.8 Effects of Plating Time on SEM562

9.4.9 The Effects of Heat Treatment on SEM570

9.5 Summary573

References573

Part Ⅳ Kinetics,Mechanism,and Theory of Electroless Plating584

10．Mechanism of Electroless Plating584

10.1 The Existing Reaction Mechanism of EP Deposits584

10.1.1 The So-Called Four Classical Mechanisms584

10.1.2 Mixed Potential Theory587

10.1.3 The Uniform Electrochemical Mechanism596

10.2 Shortcomings and Deficiencies of Existing Reaction Mechanisms of EP Deposits597

10.3 Kinetics and Recent Progress603

10.3.1 Real-Time Monitoring of Initial EP605

10.3.2 Microstructure in Initial Stage of EP609

10.3.3 Kinetics and Empirical Modeling of EP615

10.4 Summary623

References625

11．Formation Theory and Formation Range of Electroless Amorphous Alloys630

11.1 General Description of Formation of Electroless Amorphous Alloys630

11.2 Formation Theory of Electroless Amorphous Alloys633

11.2.1 A Brief Retrospect of the Quantitative Theory of Metallic Glass Formation634

11.2.2 Formation Theory of Electroless Amorphous Alloy Systems635

11.3 Formation Range of Electroless Amorphous Alloys:Experimental Facts and Theoretical Calculations658

11.3.1 Experimental Data of RAF of EP Amorphous Alloys658

11.3.2 Theoretical Calcu lation of RAF of EP Amorphous Alloys668

11.4 Summary685

References685

12．Microscopic Theory of Electroless Plating694

12.1 Why Use the Microscopic ab initio Theory to Investigate the EP Process?694

12.2 Ab initio Computational Methods695

12.2.1 Calculation Methods and Program Package695

12.2.2 Selection of the Basis Sets695

12.2.3 Selection of Oxidation Pathway697

12.2.4 Solvation Effect697

12.2.5 Catalytic Activity of Metal Surfaces698

12.3 Theoretical Results Obtained by Ab Initio Methods699

12.3.1 Reaction Mechanisms of EP Processes for Various Reductants699

12.3.2 Detailed Investigation of Atomic Interaction Between Reductants and Metal Surfaces711

12.3.3 The Role of Stabilizer and Plating Rate in EP719

12.4 Summary and Prospective724

References725

Index729